Fengbin Tu

Fengbin Tu

Ph.D. in Electronic Science and Technology, THU

Fengbin Tu (涂锋斌)

Assistant Professor

The Hong Kong University of Science and Technology (HKUST)
Department of Electronic and Computer Engineering

Fengbin Tu is an Assistant Professor and the Associate Director of the Institute of Integrated Circuits and Systems at The Hong Kong University of Science and Technology, NSFC Excellent Young Scientist (国家优青), and a core faculty member of the AI Chip Center for Emerging Smart Systems (ACCESS) under InnoHK. He received the Ph.D. degree in 2019 from the Institute of Microelectronics, Tsinghua University, under the supervision of Prof. Shaojun Wei, with the Tsinghua Excellent Dissertation Award. He was a Postdoctoral Scholar at the Scalable Energy-efficient Architecture Lab (SEAL), working with Prof. Yuan Xie, University of California, Santa Barbara, from 2019 to 2022. He was a Postdoctoral Fellow at ACCESS, from 2022 to 2023. His AI chips Thinker and ReDCIM have been recognized by the ISLPED Design Contest Award (2017) and Top-10 Research Advances in China Semiconductors (2023). He has received the MIT Technology Review “Innovators Under 35” (TR35) Asia-Pacific (2025), Gold Medal with Jury Congratulations at the Inventions Geneva (2025), and WAIC Yunfan Award-“Bright Stars” (2024). He worked with ACCESS and developed the AC-Transformer, the first Hong Kong AI chip at ISSCC (2025). Dr. Tu has an online collection of research on AI chip and architecture design, Neural Networks on Silicon, which has attracted many researchers all around the world.

Research Interests

AI Chip, Computing-in-Memory, Computer Architecture, Reconfigurable Computing

Professional Experience

Oct. 2022 - Present: The Hong Kong University of Science and Technology (HKUST)

  • Associate Director, Institute of Integrated Circuits and Systems (Since Jan. 2025)
  • Assistant Professor (Since Jun. 2023)
  • Adjunct Assistant Professor (Oct. 2022 - Jun. 2023)
  • Department of Electronic and Computer Engineering

May 2022 - Present: AI Chip Center for Emerging Smart Systems (ACCESS)

  • Faculty Member (Since Jun. 2023)
  • Postdoctoral Fellow (May. 2022 - Jun. 2023)

Oct. 2019 - May 2022: University of California, Santa Barbara (UCSB)

  • Postdoctoral Scholar, working with Prof. Yuan Xie
  • Scalable Energy-efficient Architecture Lab (SEAL)
  • Department of Electrical and Computer Engineering

Education Experience

Sep. 2013 - Jul. 2019: Tsinghua University (THU)

Sep. 2009 - Jun. 2013: Beijing University of Posts and Telecommunications (BUPT)

  • B.S. in Electronic Science and Technology
  • Beijing Outstanding Graduate (5%), GPA Rank 1/255 in the School of Electronic Engineering
  • National Scholarship for Undergraduate Students (0.2%, 2010, 2011, 2012)

Academic Services

Conference Services

  • Design Contest Chair, Asia and South Pacific Design Automation Conference (ASP-DAC 2026)
  • TPC Member, Asian Solid-State Circuits Conference (A-SSCC 2025)
  • TPC Member, Design Automation Conference (DAC 2022 - 2024)
  • TPC Member, Asia and South Pacific Design Automation Conference (ASP-DAC 2023, 2025)
  • TPC Member, International Conference on Integrated Circuits, Technologies and Applications (ICTA 2025)
  • TPC Member, International Conference on Artificial Intelligence Circuits and Systems (AICAS 2022)

Journal Editorial Board

  • Young Editorial Board Member, Journal of Semiconductors (JOS, 2024 - Present)
  • Young Editorial Board Member, Chinese Journal of Electronics (CJE, 2025 - Present)
  • Guest Editor, Special Topic: Innovative Architectures and Electronic Systems for Efficient Artificial Intelligence, Chinese Journal of Electronics (CJE, 2025)
  • Guest Editor, Special Topic: AI Chips and Systems for Large Language Models, Science China: Information Sciences (SCIS, 2024)

Honors and Awards

  • MIT Technology Review “Innovators Under 35” (TR35) Asia-Pacific (2025)
  • Gold Medal with Congratulations of the Jury at the 50th International Exhibition of Inventions Geneva (2025)
  • Nomination Award for 2024 Top-10 Research Advances in China Semiconductors (2025)
  • NSFC Excellent Young Scientists Fund (国家优秀青年科学基金, 2024)
  • 2023 Top-10 Research Advances in China Semiconductors (2024)
  • WAIC Yunfan Award-“Bright Stars” (Top-10 Chinese AI Scholars under 35, 2024)
  • Nomination Award for 2023 Chip10 Science (2024)
  • ZGC Forum Top-100 New Technologies and Products (2023)
  • Nomination Award for 2021 Top-10 Research Advances in China Semiconductors (2022)
  • Top-Pick Paper Award in Chinese Institute of Electronics (2021)
  • Beijing Outstanding Graduate (BUPT 2013, THU 2019, 5%)
  • THU Excellent Dissertation Award (2019)
  • National Scholarship for Ph.D. Students (THU 2017, 0.2%)
  • ISLPED’17 Design Contest Award (2017)
  • THU Outstanding Postgraduate Assistant (2016)
  • Lam Research Scholarship (2015)
  • Excellent Paper Award at THU-IME Ph.D. Student Forum (2015)
  • National Scholarship for Undergraduate Students (BUPT 2010, 2011, 2012, 0.2%)
  • BUPT Merit Student (2010, 2011, 2012)

Course Teaching

  • ELEC 2350: Introduction to Computer Organization and Design (Spring 2024, 2025)
  • ELEC 6910H: Advanced AI Chip and System (Fall 2024, 2025)

Contact

Address: Room 2418, 2/F (Lift 25/26), Academic Building, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China

Email: fengbintu at ust dot hk