Fengbin Tu

Fengbin Tu

Ph.D. in Electronic Science and Technology, THU

Fengbin Tu (涂锋斌)

Assistant Professor

The Hong Kong University of Science and Technology (HKUST)
Department of Electronic and Computer Engineering

Fengbin Tu is an Assistant Professor at The Hong Kong University of Science and Technology, China NSFC Excellent Young Scientist (国家优青), and a core faculty member of the AI Chip Center for Emerging Smart Systems (ACCESS) under InnoHK. He received the Ph.D. degree from the Institute of Microelectronics, Tsinghua University, under the supervision of Prof. Shaojun Wei and Prof. Shouyi Yin. He was a Postdoctoral Scholar at the Scalable Energy-efficient Architecture Lab (SEAL), working with Prof. Yuan Xie, University of California, Santa Barbara, from 2019 to 2022. He was a Postdoctoral Fellow at ACCESS, working with Prof. Tim Cheng and Prof. Chi-Ying Tsui, from 2022 to 2023. His Ph.D. dissertation entitled “Architecture Design and Memory Optimization for Neural Network Accelerators” was recognized by the Tsinghua Excellent Dissertation Award. His AI chips Thinker and ReDCIM won the 2017 ISLPED Design Contest Award and 2023 Top-10 Research Advances in China Semiconductors, respectively. He received the 2024 WAIC Yunfan Award (“Bright Stars”). Dr. Tu has an online collection of research on AI chip and architecture design, Neural Networks on Silicon, which has attracted many researchers all around the world.

Research Interests

AI Chip, Computing-in-Memory, Computer Architecture, Reconfigurable Computing

Professional Experience

Oct. 2022 - Present: The Hong Kong University of Science and Technology (HKUST)

  • Assistant Professor (Since Jun. 2023)
  • Adjunct Assistant Professor (Oct. 2022 - Jun. 2023)
  • Department of Electronic and Computer Engineering

May 2022 - Present: AI Chip Center for Emerging Smart Systems (ACCESS)

  • Faculty Member (Since Jun. 2023)
  • Postdoctoral Fellow (May. 2022 - Jun. 2023), working with Prof. Tim Cheng and Prof. Chi-Ying Tsui

Oct. 2019 - May 2022: University of California, Santa Barbara (UCSB)

  • Postdoctoral Scholar, working with Prof. Yuan Xie
  • Scalable Energy-efficient Architecture Lab (SEAL)
  • Department of Electrical and Computer Engineering

Education Experience

Sep. 2013 - Jul. 2019: Tsinghua University (THU)

  • Ph.D. in Electronic Science and Technology
  • Dissertation: Architecture Design and Memory Optimization for Neural Network Accelerators
  • Beijing Outstanding Graduate (5%), GPA Rank 2/20 in the Institute of Microelectronics
  • National Scholarship for Ph.D. Students (0.2%, 2017)

Sep. 2009 - Jun. 2013: Beijing University of Posts and Telecommunications (BUPT)

  • B.S. in Electronic Science and Technology
  • Beijing Outstanding Graduate (5%), GPA Rank 1/255 in the School of Electronic Engineering
  • National Scholarship for Undergraduate Students (0.2%, 2010, 2011, 2012)

Academic Services

Conference Services

  • TPC Member, Design Automation Conference (DAC 2022 - 2024)
  • TPC Member, Asia and South Pacific Design Automation Conference (ASP-DAC 2023, 2025)
  • TPC Member, IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS 2022)
  • TPC Member, Ph.D. Forum at DAC (2024)
  • TPC Member, The 1st International Workshop on Acceleration and Optimization of Multi-modal Computing (ISCA Workshop, AOMC 2024)

Journal Editor

  • Journal of Semiconductors (JOS Youth Editorial Board Member, 2024 - Present)
  • Science China: Information Sciences (SCIS Guest Editor for Special Topic: AI Chips and Systems for Large Language Models, 2024)

Journal Reviewer

  • IEEE Journal of Solid-State Circuits (JSSC 2023 - Present)
  • IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I 2023 - Present)
  • IEEE Transactions on Circuits and Systems for Artificial Intelligence (TCASAI 2024 - Present)
  • IEEE Transactions on Computers (TC 2024 - Present)
  • IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD 2021 - Present)
  • IEEE Transactions on Circuits and Systems for Video Technology (TCSVT 2023 - Present)
  • IEEE Open Journal of the Solid-State Circuits Society (OJ-SSCS 2022 - Present)
  • IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS 2021 - Present)
  • IEEE Micro (2021 - Present)
  • ACM Transactions on Design Automation of Electronic Systems (TODAES, Since 2024)

Honors and Awards

  • China NSFC Excellent Young Scientist Scheme (国家优秀青年科学基金, 2024)
  • 2023 Top-10 Research Advances in China Semiconductors (2024)
  • WAIC Yunfan Award (“Bright Stars”, Top-10 Chinese AI Scholars under 35, 2024)
  • Nomination Award for 2023 Chip10 Science (2024)
  • ZGC Forum Top-100 New Technologies and Products (2023)
  • Nomination Award for 2021 Top-10 Research Advances in China Semiconductors (2022)
  • Top-Pick Paper Award in Chinese Institute of Electronics (2021)
  • Beijing Outstanding Graduate (BUPT 2013, THU 2019, 5%)
  • THU Excellent Dissertation Award (2019)
  • THU Outstanding Student Scholarship (2016, 2018)
  • THU-IME Outstanding Young Researcher Award (2018)
  • National Scholarship for Ph.D. Students (THU 2017, 0.2%)
  • ISLPED’17 Design Contest Award (2017)
  • THU Outstanding Postgraduate Assistant (2016)
  • ICFC Fellowship for Outstanding Ph.D. Students (2016)
  • Lam Research Scholarship (2015)
  • Excellent Paper Award at THU-IME Ph.D. Student Forum (2015)
  • National Scholarship for Undergraduate Students (BUPT 2010, 2011, 2012, 0.2%)
  • BUPT Merit Student (2010, 2011, 2012)

Course Teaching

  • ELEC 2350: Introduction to Computer Organization and Design (Spring 2024)
  • ELEC 6910H: Advanced AI Chip and System (Fall 2024)

Contact

Address: Room 2418, 2/F (Lift 25/26), Academic Building, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China

Email: fengbintu at ust dot hk