Fengbin Tu

Fengbin Tu

Ph.D. in Electronic Science and Technology, THU

Fengbin Tu (涂锋斌)

Assistant Professor

The Hong Kong University of Science and Technology (HKUST)
Department of Electronic and Computer Engineering

Fengbin Tu is an Assistant Professor and the Associate Director of the Institute of Integrated Circuits and Systems at The Hong Kong University of Science and Technology, NSFC Excellent Young Scientist (国家优青), and a core faculty member of the AI Chip Center for Emerging Smart Systems (ACCESS) under InnoHK. He received the Ph.D. degree from the Institute of Microelectronics, Tsinghua University, under the supervision of Prof. Shaojun Wei. He was a Postdoctoral Scholar at the Scalable Energy-efficient Architecture Lab (SEAL), working with Prof. Yuan Xie, University of California, Santa Barbara, from 2019 to 2022. He was a Postdoctoral Fellow at ACCESS, from 2022 to 2023. His Ph.D. dissertation entitled “Architecture Design and Memory Optimization for Neural Network Accelerators” was recognized by the Tsinghua Excellent Dissertation Award. His AI chips Thinker and ReDCIM won the 2017 ISLPED Design Contest Award and 2023 Top-10 Research Advances in China Semiconductors, respectively. He received the 2024 WAIC Yunfan Award-“Bright Stars”. He worked with ACCESS and develeoped the AC-Transformer, the first Hong Kong AI chip at ISSCC (2025). Dr. Tu has an online collection of research on AI chip and architecture design, Neural Networks on Silicon, which has attracted many researchers all around the world.

Research Interests

AI Chip, Computing-in-Memory, Computer Architecture, Reconfigurable Computing

Professional Experience

Oct. 2022 - Present: The Hong Kong University of Science and Technology (HKUST)

  • Associate Director, Institute of Integrated Circuits and Systems (Since Jan. 2025)
  • Assistant Professor (Since Jun. 2023)
  • Adjunct Assistant Professor (Oct. 2022 - Jun. 2023)
  • Department of Electronic and Computer Engineering

May 2022 - Present: AI Chip Center for Emerging Smart Systems (ACCESS)

  • Faculty Member (Since Jun. 2023)
  • Postdoctoral Fellow (May. 2022 - Jun. 2023)

Oct. 2019 - May 2022: University of California, Santa Barbara (UCSB)

  • Postdoctoral Scholar, working with Prof. Yuan Xie
  • Scalable Energy-efficient Architecture Lab (SEAL)
  • Department of Electrical and Computer Engineering

Education Experience

Sep. 2013 - Jul. 2019: Tsinghua University (THU)

  • Ph.D. in Electronic Science and Technology
  • Dissertation: Architecture Design and Memory Optimization for Neural Network Accelerators
    • Tsinghua Excellent Dissertation Award
    • Advisor: Prof. Shaojun Wei
  • Beijing Outstanding Graduate (5%), GPA Rank 2/20 in the Institute of Microelectronics
  • National Scholarship for Ph.D. Students (0.2%, 2017)

Sep. 2009 - Jun. 2013: Beijing University of Posts and Telecommunications (BUPT)

  • B.S. in Electronic Science and Technology
  • Beijing Outstanding Graduate (5%), GPA Rank 1/255 in the School of Electronic Engineering
  • National Scholarship for Undergraduate Students (0.2%, 2010, 2011, 2012)

Academic Services

Conference Services

  • Design Contest Chair, Asia and South Pacific Design Automation Conference (ASP-DAC 2026)
  • TPC Member, Asian Solid-State Circuits Conference (A-SSCC 2025)
  • TPC Member, Design Automation Conference (DAC 2022 - 2024)
  • TPC Member, Asia and South Pacific Design Automation Conference (ASP-DAC 2023, 2025)
  • TPC Member, International Conference on Integrated Circuits, Technologies and Applications (ICTA 2025)
  • TPC Member, International Conference on Artificial Intelligence Circuits and Systems (AICAS 2022)

Journal Editorial Board

  • Journal of Semiconductors (JOS Young Editorial Board Member, 2024 - Present)
  • Chinese Journal of Electronics (CJE Young Editorial Board Member, 2025 - Present)
  • Science China: Information Sciences (SCIS Guest Editor for Special Topic: AI Chips and Systems for Large Language Models, 2024)

Honors and Awards

  • NSFC Excellent Young Scientists Fund (国家优秀青年科学基金, 2024)
  • 2023 Top-10 Research Advances in China Semiconductors (2024)
  • Gold Medal with Congratulations of the Jury at the 50th International Exhibition of Inventions Geneva (2025)
  • WAIC Yunfan Award-“Bright Stars” (Top-10 Chinese AI Scholars under 35, 2024)
  • Nomination Award for 2024 Top-10 Research Advances in China Semiconductors (2025)
  • Nomination Award for 2023 Chip10 Science (2024)
  • ZGC Forum Top-100 New Technologies and Products (2023)
  • Nomination Award for 2021 Top-10 Research Advances in China Semiconductors (2022)
  • Top-Pick Paper Award in Chinese Institute of Electronics (2021)
  • Beijing Outstanding Graduate (BUPT 2013, THU 2019, 5%)
  • THU Excellent Dissertation Award (2019)
  • THU Outstanding Student Scholarship (2016, 2018)
  • National Scholarship for Ph.D. Students (THU 2017, 0.2%)
  • ISLPED’17 Design Contest Award (2017)
  • THU Outstanding Postgraduate Assistant (2016)
  • Lam Research Scholarship (2015)
  • Excellent Paper Award at THU-IME Ph.D. Student Forum (2015)
  • National Scholarship for Undergraduate Students (BUPT 2010, 2011, 2012, 0.2%)
  • BUPT Merit Student (2010, 2011, 2012)

Course Teaching

  • ELEC 2350: Introduction to Computer Organization and Design (Spring 2024, 2025)
  • ELEC 6910H: Advanced AI Chip and System (Fall 2024, 2025)

Contact

Address: Room 2418, 2/F (Lift 25/26), Academic Building, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China

Email: fengbintu at ust dot hk